Tata Electronics, ASMPT partner for semiconductor assembly

Tata Electronics has signed a memorandum of understanding (MoU) with ASMPT Singapore to establish semiconductor assembly equipment infrastructure for its chip packaging units in Assam and Karnataka. This partnership will enhance workforce training, service engineering infrastructure, automation, and R&D in advanced packaging technologies like wirebond, flip chip, and integrated system packaging.

ASMPT will support Tata Electronics in preparing for its semiconductor assembly and test facilities in Vemagal, Karnataka, and Jagiroad, Assam while promoting energy and material efficiency for sustainable growth.  

Tata Electronics is investing Rs 1,180 billion to set up a semiconductor fab in Dholera, Gujarat, and an OSAT facility in Jagiroad, Assam, projected to create 50,000 direct and indirect jobs.