Tata Electronics, ASMPT partner for semiconductor assembly
Tata Electronics has signed a memorandum of understanding (MoU) with ASMPT Singapore to establish semiconductor assembly equipment infrastructure for its chip packaging units in Assam and Karnataka. This partnership will enhance workforce training, service engineering infrastructure, automation, and R&D in advanced packaging technologies like wirebond, flip chip, and integrated system packaging. ASMPT will support Tata Electronics in preparing for its semiconductor assembly and test facilities in Vemagal, Karnataka, and Jagiroad, Assam while promoting energy and…